Thermoelectric Assembly > Plate to Air Series

Plate to Air Series

The thermoelectric Plate to Air series used in three key applications, including liquid cooling or heating:
 

 1.  Objects directly on the cold plate, or objects on an additional cold plate of your own design;

  2.  Enclosures by attaching a thermal conductive container to the cold plate;
  3.  Liquids by attaching a thermal conductive tank or liquid heat sink to the cold plate.  


The heat is absorbed by the cold plate, pumped through the thermoelectric modules and then dissipated to the air by an air heat sink. It delivers compact and reliable cooling.

Model No Pc Max(W) Voltage(V) Current(A) Ambient(℃) Weight(Kg) L(mm) W(mm) COP
PA-160-24 160 24 7.4 -10~52 3.5 300 152 0.9
PA-115-24 115 24 5.8 -10~52 2.9 300 152 0.81
PA-75-24 72 24 3.7 -10~52 1.7 230 122 0.8
PA-75-12 70 12 7.2 -10~52 1.7 230 122 0.83